December, 2007

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Progress Made in In-situ Test Technology for Pixel Quality of Upscale Lithography Tool

A research team led by Wang Xiangchao, Research Fellow of the Laboratory for Information Optics of the Shanghai Institute of Optics and Fine Mechanics, CAS, recently made a systematic and in-depth study over the in-situ test technology for the pixel quality of upscale lithography tool in joint hands with Shanghai Micro Electronics Equipment Co., Ltd (SMEE). In the experiment, using a 100-nanometere step-and-scan lithography system platform supported by integrated circuit manufacturing equipment, researchers achieved fruitfully in the aspects of the in-situ test technology for the horizontal and vertical pixel, static and dynamic pixel, and wave front pixel difference of object glass of upscale projection lithography tool. Researchers created a series of innovative concepts and methods for the in-situ test technology for the pixel quality of 193-nanometere upscale lithography tool. Moreover, they synchronously tested the horizontal and vertical pixel by using vertical pixel in-situ test technology with the focal point. The above mentioned research achievement play instructive role in the research and development of the in-situ test technology for the pixel quality of 90- and 65-nanometere lithography tools. Meanwhile, they also lend key theoretical and technology bases for the research and development of the in-situ test technology for the pixel quality of less-than-45-nanometere lithography tools.


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